Interfacial stress decoupling enables stable palladium-based hydrogen sensing

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Authors: Rui Gao, Guozhu Zhang, Xiaoyuan Wang, Yujing Xu, Chao Zhang, Linfeng Li, Zeyu Wang, Bowei Zhang, Kazuki Nagashima, Takeshi Yanagida, Fu‐Zhen Xuan
Cited by: 2
References: 54

Abstract

Interfacial adhesion between the sensing layer and supporting substrate critically governs the long-term stability of electrical molecular sensors. However, achieving a robust heterointerface remains challenging due to the intrinsic lattice mismatch induces localized stress, which is further exacerbated by cyclic interactions between the sensing film and gas analytes. Here, we introduce a floating-structure palladium hydrogen (H2) sensor enabled by interfacial stress decoupling through a dithiol-based self-assembled monolayer (SAM). This interfacial layer acts as a molecular bridge between the palladium sensing layer and the substrate electrode, forming a dual-interface architecture that simultaneously mitigates the interfacial stress and suppresses the substrate clamping effects, thereby accelerating H2 absorption kinetics. The resulting sensor demonstrates a stable and cyclable H2 detection at concentrations up to 4 vol%, and an ultrasensitive detection limit of 1 ppm at room temperature. Moreover, we realize wafer-scale fabrication and integration of the sensor into a portable platform for real-time hydrogen leak detection. This interfacial stress-engineering approach provides a general route toward durable and high-performance molecular sensor. This study presents an interfacial stress decoupling strategy using dithiol-based self-assembled layers enabling stable palladium hydrogen sensing, demonstrating wafer-scale device fabrication and seamless integration of a portable detection platform.

Fields of Study & Subjects

Gas Sensing Nanomaterials and Sensors Molecular Junctions and Nanostructures 2D Materials and Applications

Publication details

Journal / source
Nature Communications
Publisher
Springer Science and Business Media LLC
Volume
17
Issue
1
Publication date
12 February 2026
Language
EN