Low-intensity focused ultrasound-activated piezoelectric gel bandage for diabetic wound repair and neuropathic pain relief

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Authors: Xi Li, Lizhou Lin, Mingrui Zhu, Xi Li, Jifeng Yu, Dan Lu, Shaoyue Li, Yuting Shen, Bing Xiong, Chongke Zhao, Boyang Zhou, Haohao Yin
+2 more Huixiong Xu, Xin Guan
Cited by: 3
References: 48

Abstract

Nociceptive hypersensitivity and prolonged wound healing due to the interaction of peripheral neuropathy and local immune disorders are key issues that need to be addressed in diabetic foot ulcer (DFU) regenerative repair. Here, we present a low-intensity focused ultrasound (LIFU)-activated piezoelectric gel bandage for DFU wound repair and neuropathic pain relief. Acting as an artificial “skin”, this self-powered, functionalized bandage not only temporarily shields tissue from external environment, but also serves as a drug reservoir that can in situ release nitric oxide upon LIFU to promote macrophage polarization, generate piezoelectric current to desensitize TRPV1 nociceptor for on demand neuropathic pain relief and produce reactive oxygen species to eliminate pathogens in male rodents. More importantly, this regimen can promote CGRP neuropeptides release from sensory neurons to invigorate M2-like macrophages-mediated protective cutaneous immunity. This LIFU-activated immune-nociceptor modulation strategy is potentially applicable to other non-healing tissue regeneration. Nociceptive hypersensitivity and prolonged wound healing due to the interaction of peripheral neuropathy and local immune disorders hinder the regenerative repair of diabetic foot ulcer. Here, the authors report a low-intensity focused ultrasound-activated piezoelectric gel bandage with immune homeostasis modulation and neuropathic pain relief functions for comprehensive repair of diabetic wounds.

Fields of Study & Subjects

Wound Healing and Treatments Planarian Biology and Electrostimulation Burn Injury Management and Outcomes

Publication details

Journal / source
Nature Communications
Publisher
Springer Science and Business Media LLC
Volume
17
Issue
1
Publication date
19 March 2026
Language
EN