Peritectic engineering enhanced thermoelectrics for smart thermal messaging devices

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Authors: Jiwu Xin, Ziwang Luo, Wang Li, Pengyu Zhang, Chengyun Xu, Shixing Yuan, Wulong Li, Long Chen, Tianzhu Zhou, Yuntian Wang, Abdul Basit, Yubo Luo
+3 more Junyou Yang, Ting Zhang, Lei Wei
Cited by: 1
References: 41

Abstract

Autonomous, bio-integrated electronic systems, such as smart prosthetics and functional electronic skins, require materials combining energy harvesting with perception. Although Indium Antimonide is well established in high-speed electronics owing to its high electron mobility, yet its large intrinsic thermal conductivity has limited its use in thermoelectric energy harvesting. Here, we introduce a peritectic engineering strategy to reduce the thermal bottleneck. Thermodynamic control of the peritectic reaction generates hierarchical InBi@(Bi, Sb) core–shell nanostructures that reduce the room-temperature lattice thermal conductivity from 13.1 to 6.84 W m-1 K-1. This microstructural manipulation raise the power factor by 98% at 473 K, yielding a marked decoupling of electron and phonon transport. A compact, self-powered InSb-InBi/Cu3InSnSe5 module drives commercial electronics under moderate thermal gradients. The module also functions as a zero-power thermo-tactile interface for prosthetic limbs, enabling covert thermal messaging via Morse code decoded by a transfer learning algorithm a transfer learning algorithm. This platform enables the integration of thermoelectric materials into intelligent human-machine interfaces, advancing the development of self-powered sensory systems. The study reports on a peritectic engineering strategy to achieve enhanced electrical performance in InSb thermoelectrics. This material platform enables smart prosthetics with machine learning-assisted tactile sensing and messaging capabilities.

Fields of Study & Subjects

Advanced Thermoelectric Materials and Devices Transition Metal Oxide Nanomaterials Thermal properties of materials

Publication details

Journal / source
Nature Communications
Publisher
Springer Science and Business Media LLC
Volume
17
Issue
1
Publication date
15 April 2026
Language
EN