Wafer-scale conformal metasurface optics

Read full text
Authors: Louis Martin‐Monier, Sehui Chang, Johannes Froech, Zhaoyi Li, Luigi Ranno, Khoi Phuong Dao, Akira Ueno, Jia Xu Brian Sia, Hanyu Zheng, Padraic Burns, Tian Gu, Young Min Song
+2 more Arka Majumdar, Juejun Hu
Cited by: 0
References: 34

Abstract

Curved and conformal optics provide additional geometric degrees of freedom that enable enhanced optical performance while satisfying non-optical constraints such as ergonomics, aerodynamics, and wearability. However, existing fabrication approaches for curved metasurfaces are limited in scalability, geometry control, and alignment accuracy. Here we show a scalable fabrication strategy for curved and conformal metasurface optics based on thermoforming, an industry-standard manufacturing process for thermoplastics. Our approach enables wafer-scale production of highly curved metasurfaces with millimeter-level radii of curvature and micron-level alignment precision. We develop a predictive thermorheological model that accurately captures and compensates for the large deformations induced during thermoforming, preserving the intended optical response and enabling diffraction-limited performance. As demonstrations, we realize freestanding curved metalenses, conformal refractive-metasurface hybrid optics, and an artificial compound eye with a wide field of view, reduced aberrations, and uniform imaging performance. These results establish thermoforming as a scalable manufacturing platform for next-generation conformal photonic systems. Researchers developed a scalable thermoforming strategy for wafer-scale curved metasurface optics, enabling high-performance conformal optical devices including hybrid lenses and artificial compound eyes for next-generation photonic systems.

Fields of Study & Subjects

Metamaterials and Metasurfaces Applications Advanced Materials and Mechanics Orbital Angular Momentum in Optics

Publication details

Journal / source
Nature Communications
Publisher
Springer Science and Business Media LLC
Volume
17
Issue
1
Publication date
18 September 2026
Language
EN