Multiscale investigation of thermal transport in β-Ga2O3-based heterointerfaces enabled by machine learning potential: cross-scale parameter

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Authors: Zhanpeng Sun, Zijun Qi, Yunfei Song, Lijie Li, Sheng Liu, Wei Shen, Gai Wu
Cited by: 4
References: 55

Abstract

The rising power density of advanced electronics demands improved thermal management, while traditional single-scale methods are unable to fully reveal the complex heat transfer mechanisms in heterostructures. This work establishes a multiscale simulation framework by constructing a machine learning potential, enabling accurate cross-scale parameter transfer from atomic to mesoscopic and then to macroscopic levels. Results show that the thermal boundary resistance (TBR) at the β-Ga 2 O 3 /diamond interface is higher than that at the β-Ga 2 O 3 /Si and β-Ga 2 O 3 /SiC interfaces, and that the TBR decreases with increasing temperature, which contradicts conventional understanding. Vibrational density of states and interface conductance modal analysis elucidate the underlying mechanisms. These mesoscale insights are incorporated into macroscopic simulations, showing the β-Ga 2 O 3 /diamond heterostructure’s peak power capability reaches 226% of that of β-Ga 2 O 3 /Si. Further analysis reveals that although the thermal conductivity of the heat-spreading substrate remains the dominant factor in overall thermal performance, the thermal bottleneck gradually shifts toward the interface as both substrate conductivity and operating temperature rise. Moreover, crystal orientation significantly influences thermal performance and thermal stress distribution, necessitating careful trade-offs. This study not only provides effective strategies for optimizing β-Ga 2 O 3 -based devices but also establishes a generalizable paradigm for cross-scale thermal management research in heterogeneous material systems.

Fields of Study & Subjects

Ga2O3 and related materials Thermal properties of materials Transition Metal Oxide Nanomaterials

Publication details

Journal / source
npj Computational Materials
Publisher
Springer Science and Business Media LLC
Volume
12
Issue
1
Publication date
18 February 2026
Language
EN