Abrasion-resistant bioelectronics based on a three-dimensional topological architecture and covalent chemical anchoring

Nature Electronics 2026

View at publisher
Authors: Yewei Huang, Liangpeng Chen, Jian‐Cheng Lai, Bowen Cao, Yuhui Wang, Zitong Xu, Yuhang Ye, Tianyu Cai, Ziyang Li, Lingyi Bi, Benjamin Chacon, WANG JIA
+3 more Yury Gogotsi, Deling Li, Yuanwen Jiang
DOI: 10.1038/s41928-026-01625-0
Cited by: 4
References: 53

Fields of Study & Subjects

Molecular Junctions and Nanostructures Synthesis and Properties of Aromatic Compounds Surface Chemistry and Catalysis

Publication details

Journal / source
Nature Electronics
Publisher
Springer Science and Business Media LLC
Volume
9
Issue
6
Pages
698–711
Publication date
4 May 2026
Language
EN