Characterizing second-order topological insulators via entanglement topological invariant in two-dimensional systems

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Authors: Yu-Long Zhang, Yu-Long Zhang, Cheng-Ming Miao, Qing‐Feng Sun, Jian-Jun Liu, Ying‐Tao Zhang, Ying‐Tao Zhang
Cited by: 1
References: 53

Abstract

Higher-order topological insulators have attracted significant interest in recent years. However, identifying a universal topological invariant capable of characterizing higher-order topology remains challenging. Here, we propose a entanglement topological invariant designed to characterize second-order topological systems. This entanglement topological invariant captures the entanglement of topological corner states under open boundary conditions by employing a bipartite entanglement entropy method. In several representative models, the entanglement topological invariant assumes a nonzero value exclusively in the presence of second-order topology, with its magnitude exactly matching the number of topologically protected corner states. Consequently, the proposed entanglement topological invariant not only provides a clear criterion for detecting higher-order topology, but also offers a quantitative measure for the related corner states. Our study establishes a universal and precise method for characterizing higher-order topological phases, opening avenues for their fundamental understanding and future investigations. Higher-order topological insulators have become a focus of research, but developing a universal way to characterize their unique higher-order topological properties remains a key challenge. The authors propose an entanglement topological invariant based on entanglement entropy, which not only reliably identifies second-order topological phases but also quantifies the number of topologically protected corner states.

Fields of Study & Subjects

Topological Materials and Phenomena Quantum many-body systems Quantum and electron transport phenomena

Publication details

Journal / source
Communications Physics
Publisher
Springer Science and Business Media LLC
Volume
9
Issue
1
Publication date
22 January 2026
Language
EN