Minimizing interface defects and enhancing optical brightness of µLEDs through polymeric encapsulants
Abstract
The need for high resolution microLED arrays, for applications in chip-level optical interconnects and augmented/virtual reality displays, requires the continuing miniaturization of the LED to reduce the pixel size and enable high pixel density. Miniaturization typically degrades brightness because of surface-related non-radiative recombination. Here we demonstrate a combined dry/wet etching process with polymeric encapsulation to construct InGaN-based microLEDs that show negligible degradation due to sidewall effects for devices having diameters as small as 6 µm. The microLEDs exhibit low surface recombination velocities (
Fields of Study & Subjects
Nanofabrication and Lithography Techniques
Luminescence and Fluorescent Materials
Polymer Surface Interaction Studies
Publication details
- Journal / source
- Communications Engineering
- Publisher
- Springer Science and Business Media LLC
- Volume
- 5
- Issue
- 1
- Publication date
- 21 April 2026
- Language
- EN