Digital twin platform for accelerating optimization of oxide semiconductor transistors to overcome fundamental performance-reliability trade-off

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Authors: Tanvir Haider Pantha, Minjong Lee, Kharanshu Bhojak, Thi Thu Huong Chu, MinGyeong Jo, Seungbin Lee, 민현홍, Gawnghyeon Jang, Shumiya Alam, Si Joon Kim, Jiyoung Kim, Sourav Dutta
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References: 6

Abstract

Abstract Amorphous oxide semiconductor (AOS) transistors are promising candidates for nextgeneration logic and high-density memory technologies, particularly for back-end-of-line– compatible monolithic three-dimensional integration. However, their widespread adoption is limited by a persistent trade-off between device performance and long-term reliability, the optimization of which conventionally requires exhaustive exploration of high-dimensional material, process, and device parameter spaces. Here, we introduce a closed-loop digital twin framework that accelerates AOS transistor optimization by integrating device fabrication, electrical characterization, circuit simulation, surrogate modeling and Bayesian active learning. Gaussian process–based surrogate models are used to link low-level fabrication parameters to device- and application-level performance and reliability metrics, enabling data-efficient, multi-objective optimization across the technology stack. By actively prioritizing the most informative experiments, the framework achieves over 3x reduction in experimental effort compared with exhaustive search. We demonstrate the approach using top-gated IGZO transistors spanning 80 gate oxide process splits and extend the optimization beyond device metrics to application-aware DRAM performance. This digital twin paradigm provides a scalable pathway to systematically navigate performance–reliability trade-offs and accelerate the development of emerging semiconductor technologies.

Fields of Study & Subjects

Thin-Film Transistor Technologies Semiconductor materials and devices Advancements in Semiconductor Devices and Circuit Design

Publication details

Journal / source
Communications Engineering
Publication date
17 August 2026
Language
EN