Packaging and integration of silicon carbide power devices

Nature Reviews Electrical Engineering 2026

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Authors: Laili Wang, Fengtao Yang, Yunqing Pei, Xu Yang, Leo Lorenz

DOI: 10.1038/s44287-026-00263-0

Cited by: 10

References: 137

Fields of Study & Subjects

Silicon Carbide Semiconductor Technologies 3D IC and TSV technologies Electronic Packaging and Soldering Technologies

References 137