Meta-topological hydrogel enables multisource and frequency-tailored artefact mitigation for bioelectronics

Read full text
Authors: Guo Tian, Longchao Huang, Xinglong Pan, Zhiwei Li, Wanheng Lu, Wei Li Ong, Chang Liu, Yi Zhou, Yue Sun, Weili Deng, Weiqing Yang, Wei Gao
+1 more Ghim Wei Ho
Cited by: 3
References: 42

Abstract

High-fidelity signal acquisition underpins next-generation healthcare bioelectronics, yet motion artefacts severely impair both signal integrity and measurement reliability. Existing mitigation strategies primarily target a single artefact type or a fixed frequency range, limiting scalability and generality. Here we report a meta-topological hydrogel that combines programmable phononic metastructure filtering with topology-tunable ion diffusion to suppress multisource mechanical and biopotential artefacts across tailored frequency ranges. This artefact-mitigating platform enables simultaneous, artefact-free acquisition of haemodynamic and electrophysiological signals, achieving ISO-grade A blood pressure accuracy and an electrocardiograph signal-to-noise ratio of 37.36 dB during daily activities. The platform supports robust feature extraction from physiological signals for fatigue profiling, achieving a deep learning classification accuracy of 92.04%. We further demonstrate effective artefact suppression across diverse biosignals modalities, including heart and respiratory sounds, voice, electroencephalogram and electrooculogram, highlighting its potential for scalable and kinematic-tolerant monitoring in motion-intensive scenarios. A meta-topological hydrogel suppresses multisource motion artefacts across tailored frequencies, enabling artefact-free haemodynamic and electrophysiological recording with robust fatigue profiling.

Fields of Study & Subjects

Advanced Sensor and Energy Harvesting Materials Phonocardiography and Auscultation Techniques Muscle activation and electromyography studies

Publication details

Journal / source
Nature Sensors
Publisher
Springer Science and Business Media LLC
Volume
1
Issue
5
Pages
413–424
Publication date
24 March 2026
Language
EN