Effect of ultrasonic field on controlled organic stripping layer formation and its application in electrodeposition of ultra-thin copper foil

CrystEngComm 2026

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Authors: Guangmao Yin, Junqing han, Yuxi Zhu, Xinxin Song, Jianyuan Wang, Yuying Wu, Xiangfa Liu
DOI: 10.1039/d5ce01168j
Cited by: 0
References: 33

Abstract

This study demonstrates that electroplating a nickel metal layer onto the surface of copper foil substrates followed by ultrasonic adsorption of an organic layer can be used to fabricate peelable ultra-thin copper foil (

Fields of Study & Subjects

Electrodeposition and Electroless Coatings Copper-based nanomaterials and applications Electronic Packaging and Soldering Technologies

Publication details

Journal / source
CrystEngComm
Volume
28
Issue
7
Pages
1187–1196
Publication date
1 January 2026
Language
EN