Leveraging lignin's ortho -methoxy groups for intramolecular hydrogen bonding to reduce the dielectric constant of epoxy resins

Green Chemistry 2026

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Authors: Fengyuan Zhang, Haoyang Jin, Haoyu Shen, Longtao Wang, Shanshan Dai, Shuai Du, Shuaiqi Yang, Benlin Hu, Songqi Ma
DOI: 10.1039/d5gc04984a
Cited by: 3
References: 61

Abstract

This work presents an innovative strategy for demethoxylation-free valorization of lignin into bio-based epoxy resins with reduced dielectric constant.

Fields of Study & Subjects

Lignin and Wood Chemistry Polymer composites and self-healing Epoxy Resin Curing Processes

Publication details

Journal / source
Green Chemistry
Publisher
Royal Society of Chemistry (RSC)
Volume
28
Issue
5
Pages
2376–2384
Publication date
1 January 2026
Language
EN