Decision letter for "Analysis of Mechanical Properties in Lead-Free Solders Subjected to Flash Aging"

2026

View at publisher
DOI: 10.1039/d5ma01436k/v2/decision1
Cited by: 0

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Metallurgical and Alloy Processes Advanced Welding Techniques Analysis

Publication details

Publication date
10 January 2026