Adhesion enhancement between colorless biphenyl polyimide copolymerized film and magnetron sputtering Cu for FPC circuit board

Journal of Materials Chemistry C 2026

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Authors: Yan Liu, Zhizhi Hu, Zhiyong Xiao, Xinming Wang, Ziyang Gao, Yimin Zhu, Qifeng Lu, Hongbin Zhao, Wei Chen, Ke Ma
DOI: 10.1039/d5tc03165f
Cited by: 0
References: 29

Abstract

Polyimide (PI) film is one of the world's leading thin film insulation materials, which can be used in electronic applications in the aerospace, medical, and automotive industries.

Fields of Study & Subjects

Synthesis and properties of polymers Electronic Packaging and Soldering Technologies Copper Interconnects and Reliability

Publication details

Journal / source
Journal of Materials Chemistry C
Volume
14
Issue
14
Pages
5818–5826
Publication date
1 January 2026
Language
EN