Effect of an ultrasonic field on the nucleation and growth mechanism of electrodeposited Cu thin films on a magnetron sputtered Cu layer

Journal of Materials Chemistry C 2026

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Authors: Yaning Chai, Haijun Hu, Fenfen Huang, Zhi Li, Qiming Liang, Hou Yao, Shuo Tong, Yu Sun, Rui Feng, Xinde Zhu
DOI: 10.1039/d5tc03483c
Cited by: 2
References: 51

Abstract

Composite copper foil and ultra-thin copper foil are prepared through the synergistic application of magnetron sputtering and electrodeposition techniques.

Fields of Study & Subjects

Electrodeposition and Electroless Coatings Nanomaterials and Printing Technologies Microstructure and mechanical properties

Publication details

Journal / source
Journal of Materials Chemistry C
Publisher
Royal Society of Chemistry (RSC)
Volume
14
Issue
14
Pages
5907–5921
Publication date
1 January 2026
Language
EN