Dual-function conductive silver paste: application of an epoxy system based on curing resistance evolution in packaging and flexible electronics
Abstract
Epoxy resin-based silver paste (SP) has garnered widespread attention in chip packaging owing to its superior mechanical properties and interfacial adhesion.
Fields of Study & Subjects
Electronic Packaging and Soldering Technologies
Nanomaterials and Printing Technologies
Epoxy Resin Curing Processes
Publication details
- Journal / source
- Journal of Materials Chemistry C
- Publisher
- Royal Society of Chemistry (RSC)
- Volume
- 14
- Issue
- 13
- Pages
- 5411–5422
- Publication date
- 1 January 2026
- Language
- EN