Hybrid copper–silver nanoparticle inks and their performance under thermal and photonic sintering

Journal of Materials Chemistry C 2026 Open access

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Authors: David Pervan, Robyn Worsley, Anil Bastola, Christopher Tuck, Ricky D. Wildman, Richard Hague, Edward Lester
DOI: 10.1039/d5tc03927d
Cited by: 2
References: 90

Abstract

One-step, scalable, and controllable continuous-flow production of hybrid copper–silver inks yields conductive films following simple thermal sintering in air, in contrast to copper-only films.

Fields of Study & Subjects

Nanomaterials and Printing Technologies Copper-based nanomaterials and applications Copper Interconnects and Reliability

Publication details

Journal / source
Journal of Materials Chemistry C
Publisher
Royal Society of Chemistry (RSC)
Volume
14
Issue
14
Pages
5720–5733
Publication date
1 January 2026
Language
EN