Decision letter for "Hybrid Copper─Silver Nanoparticle Inks and Their Performance Under Thermal and Photonic Sintering"
Fields of Study & Subjects
Nanomaterials and Printing Technologies
Gold and Silver Nanoparticles Synthesis and Applications
Electronic Packaging and Soldering Technologies
Publication details
- Journal / source
- Publons reviews and discussion
- Publication date
- 6 February 2026
- Language
- EN