Theoretical screening of Co- and Mo-based binary alloys as interconnect metals
Abstract
This work presents the candidate screening procedure of binary intermetallic compounds for future metal interconnects using cohesive energy, and directionally averaged figure of merit.
Fields of Study & Subjects
Copper Interconnects and Reliability
Semiconductor materials and interfaces
Electrodeposition and Electroless Coatings
Publication details
- Journal / source
- Journal of Materials Chemistry C
- Publisher
- Royal Society of Chemistry (RSC)
- Volume
- 14
- Issue
- 15
- Pages
- 6251–6256
- Publication date
- 1 January 2026
- Language
- EN