High-resolution array devices via insulating pattern definition layer transferred by UV-adhesive stamp

Journal of Materials Chemistry C 2026

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Authors: Xudong Jiang, Jie Li, Zunxian Yang, Yue Chen, Luxi Yuan, Wenxin Tang, Yuting Bai, Jiajie Hong, Benfang Liu, Zheyu Zhou, Runsen Yu, Wenxin Zhang
+11 more Shangwei Ye, Zhiqian Wei, Zhezhou Fang, Jinzhu Gao, Zhiyu Yuan, Shunchang Cheng, Yuhan Meng, Zhiqi Lin, Tailiang Guo, Zhenzhen Weng, Yongyi Chen
DOI: 10.1039/d5tc04141d
Cited by: 1
References: 38

Abstract

(1) A UV-adhesive stamp was applied to address the solvent compatibility issue. (2) Insulating layer patterning could protect the functional layers from physical damage. (3) The device maintained an EQE of 10% while achieving a luminance of 40 000 cd m −2 .

Fields of Study & Subjects

3D IC and TSV technologies Nanofabrication and Lithography Techniques Nanomaterials and Printing Technologies

Publication details

Journal / source
Journal of Materials Chemistry C
Publisher
Royal Society of Chemistry (RSC)
Volume
14
Issue
12
Pages
4839–4849
Publication date
1 January 2026
Language
EN