Large-area metal sinter-joining in power electronics packaging: challenges and perspectives

Journal of Materials Chemistry C 2026

View at publisher
Authors: Lele Yang, Gaohui Xu, Haidong Yan, Chuantong Chen, Lei Su, Ke Li, Wanli Li
DOI: 10.1039/d5tc04165a
Cited by: 2
References: 79

Abstract

This paper reviews large-area metal paste sinter joining, focusing on the progress and challenges related to delamination, warpage, and reliability—findings that are crucial for the development of highly reliable power electronics.

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Silicon Carbide Semiconductor Technologies

Publication details

Journal / source
Journal of Materials Chemistry C
Publisher
Royal Society of Chemistry (RSC)
Volume
14
Issue
9
Pages
3414–3426
Publication date
1 January 2026
Language
EN