Air-sinterable copper pastes for next-generation electronics: a review

Journal of Materials Chemistry C 2026

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Authors: Xinyi Shi, Songtang Li, Su Ding, Minggang Li, Junfeng Sun, Ke Li, Wanli Li
DOI: 10.1039/d5tc04491j
Cited by: 4
References: 108

Abstract

Growing demand for high-power, smart electronics drives air-sinterable copper paste development, addressing their oxidation and strict sintering issues. This work reviews its advances, applications and industrialization challenges.

Fields of Study & Subjects

Nanomaterials and Printing Technologies Electronic Packaging and Soldering Technologies Electrical and Thermal Properties of Materials

Publication details

Journal / source
Journal of Materials Chemistry C
Publisher
Royal Society of Chemistry (RSC)
Volume
14
Issue
12
Pages
4696–4710
Publication date
1 January 2026
Language
EN