Recent progress in alternative metals for advanced interconnects

Journal of Materials Chemistry C 2026 Open access

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Authors: Ju Young Sung, Chae Hyun Lee, Yebin Lim, In Su Oh, Sang Hyeok Lee, Kyeong Hyeon Choi, Sang Woon Lee
DOI: 10.1039/d6tc00317f
Cited by: 5
References: 204

Abstract

Alternative interconnect materials with short electron mean free paths can mitigate the resistivity size effect beyond Cu. Single-element, binary, ternary, and topological candidates are discussed with key integration challenges.

Fields of Study & Subjects

Copper Interconnects and Reliability Semiconductor materials and interfaces 3D IC and TSV technologies

Publication details

Journal / source
Journal of Materials Chemistry C
Publisher
Royal Society of Chemistry (RSC)
Volume
14
Issue
16
Pages
6558–6580
Publication date
1 January 2026
Language
EN