Quality control of outsole products using SPC and FTA methods

AIP conference proceedings 2026

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Authors: S. Sunariyah, Wiwik Sulistyowati, Atikha Sidhi Cahyana, Tedjo Sukmono, Tuxtasinova Odina

DOI: 10.1063/5.0296157

Cited by: 0

References: 4

Fields of Study & Subjects

Reliability and Maintenance Optimization Electronic Packaging and Soldering Technologies Integrated Circuits and Semiconductor Failure Analysis

References 4