Filtered cathodic vacuum arc: Unlocking the future of multifunctional coatings through hybrid deposition techniques

The advent of filtered cathodic vacuum arc (FCVA) technology has revolutionized the deposition of high-performance multifunctional coatings by combining dense microstructures with minimal defect formation. Unlike conventional physical vapor deposition and chemical vapor deposition processes, FCVA operates effectively at low temperatures while simultaneously addressing two long-standing challenges: macroparticle contamination and high-thermal stress on substrates. These advantages enable its successful application across diverse industrial domains, including semiconductor device fabrication, aerospace engineering, biomedical implants, and flexible electronic systems. This review provides a comprehensive overview of the fundamental principles, technological evolution, and material systems enabled by FCVA. Attention is given to plasma filtration architectures and their influence on ion transport, macroparticle suppression, and their relationship to film growth. Recent developments in substrate biasing strategies, reactive plasma control, and real-time plasma diagnostics are discussed as key approaches for regulating stress, microstructure, and coating uniformity. In addition, the integration of FCVA with other plasma-based deposition techniques is examined as a route to extending compositional flexibility and functional performance. By enabling the design of tailored multifunctional coatings, FCVA is poised to accelerate the deployment of next-generation technologies ranging from temperature-sensitive electronic devices to lightweight aerospace structures and biocompatible medical systems. The paper concludes with a forward-looking discussion on scalability, cost considerations, and sustainable processing strategies, outlining the conditions under which FCVA may remain competitive within the broader landscape of advanced coating technologies.