Writing metasurfaces by hand: A pen-based MXene approach for flexible and low-waste paper platforms

The integration of flexibility, electrical conductivity, and cost-effectiveness remains a central challenge in the fabrication of metasurfaces for electromagnetic applications. Here, we introduce a hybrid pen-based and mask-assisted fabrication strategy for Ti3C2Tx MXene-based metasurfaces on paper substrates, enabling precise patterning with minimal material waste. The approach combines screen-printing-derived adhesive masks with a direct ink writing process using MXene inks, yielding conformable and conductive metasurfaces that operate efficiently across the microwave range. Atomic force microscopy and scanning electron microscopy analyses confirmed the formation of uniform, ultra-smooth MXene films (root-mean-square roughness ≈438 pm, with a thickness of ≈13μm) atop paper layers with a total device thickness of 163.6μm. Experimental transmission spectra revealed strong stopband resonances for metasurfaces based on square-ring and split-ring resonators, with reflection dips near −12 dB. These results are consistent with finite-element method simulations performed using COMSOL Multiphysics, confirming the consistency between numerical predictions and laboratory measurements. The main limitation we observed was the moderate conductivity of our prepared MXene films (8.97×103 S/m), which can be enhanced through ink optimization. The low-cost, scalable, and sustainable MXene patterning shown in this work opens new opportunities for fabricating lightweight, flexible, and reconfigurable electromagnetic devices, particularly in wearable and next-generation wireless communication systems.