Enhancing magnetoelectric coupling in Ni/PMN-PZT/Ni laminates by Ni electroplating

View at publisher
Authors: R. Kim, Donggeon Baek, Burcu Dursun, Dayeong Hur, Kae Nakamura, Hyunseok Song, Jung Min Park, Ho-Yong Lee, Susan Trolier-McKinstry, Jungho Ryu
Cited by: 1
References: 39

Abstract

Adhesive-free 2-2 structured Ni/Pb(Mg1/3Nb2/3)O3–PbZrTiO3/Ni laminates were realized by directly electroplating magnetostrictive Ni onto [011]-oriented Pb(Mg1/3Nb2/3)O3-Pb(Zr,Ti)O3 (PMN-PZT) single crystals for operation in the d32 mode, thereby maximizing interfacial bonding and suppressing viscoelastic coupling losses associated with polymer adhesive layers. Finite element analysis comparing the presence/absence of an interlayer, single crystal vs ceramic piezoelectrics, and variations in Ni thickness shows that removing a polymeric adhesive layer increases the induced piezoelectric potential by approximately 13% that single crystals deliver ∼1.3 times higher output than ceramics at identical Ni thickness, and that the response grows, then saturates with Ni thickness under the same excitation condition. Uniform polycrystalline Ni layers with soft magnetic characteristics and controlled thickness were obtained by direct Ni electroplating on PMN-PZT single crystals. Under off-resonance condition, the direct magnetoelectric voltage coefficient increases with Ni thickness and reaches 6.9 V/cm Oe at bias fields below 100 Oe. At the electromechanical resonance, the coefficient is strongly amplified to 1419 V/cm Oe. These results indicate that combining direct Ni electroplating on 32 mode single crystals enhances interfacial stress transfer and magneto-electromechanical conversion, providing a scalable route to high magnetoelectric responses for sensitive magnetic field sensing, low-frequency magnetoelectric antennas, and other applications.

Fields of Study & Subjects

Multiferroics and related materials Ferroelectric and Piezoelectric Materials Shape Memory Alloy Transformations

Publication details

Journal / source
Applied Physics Letters
Publisher
AIP Publishing
Volume
128
Issue
3
Publication date
19 January 2026
Language
EN