Comparative numerical investigation of four stepped micropin fin heat sink in electronic cooling

The heat dissipation from various complex devices like computer servers, processor, etc. are continuously increasing with the current trend of miniaturization. To solve the issue of thermal management in these devices, various cooling techniques were evolved. Among them, microchannel heat sink (MCHS) has gained the commercial application due to various advantages. In present work, micro pin configuration of MCHS was numerically studied. Three different cases of 4-stepped micro pin fin heatsink (MPFSH)were simulated using commercial code for varying mass flow rate at constant heat flux of 600 kW/m2. The mass flow rate was chosen in such a way that the coolant flow remains laminar in the heat sink channel. Among different cases, it was observed that 0.7-0.8-0.9-1.0 has yielded maximum value of Nusselt number (Nu). However, lowest bottom wall substrate temperature was observed in 0.6-0.7-0.8-0.9. Furthermore, pressure drop (ΔP) penalty is not much observed at low Reynold number and a significant difference is observed at higher value. Also, maximum pressure drop is observed for 0.6-0.7-0.8-0.9 configuration.