Thermal optimization of 3D-Printed mini-channel coolers: insights from experiments and simulations

This study evaluates the thermal performance of an additively manufactured mini-channel cooler produced via stereolithography. The heat sink features internal aluminum mini-channels encased in ABS. Six models were tested: three with varying outer casing geometries (A1–A3) and three with different heat sink geometries (B1–B3) – under constant heat flux from an electronic chip, using water as coolant. Numerical simulations and experiments assessed chip temperature, Nusselt number, pressure drop, Performance Evaluation Factor, and thermal resistance across mass flow rates of 0.001–0.007 kg/s. The model A3 exhibited a significant improvement in the average Nusselt number, reaching an increase of 53.3% at a mass flow rate of 0.001 kg/s. In contrast, Model B2 showed an improvement of 8.78% compared to Model B1 at the same flow rate, despite a substantial increase in pressure drop, which was approximately 300% higher than that of Model A3. The highest thermal resistance was observed in Model A2, with an increase of 32%, whereas Model B2 demonstrated the lowest thermal resistance, with a decrease of 23.6%. The findings demonstrate the promise of polymer-based, 3D-printed coolers for compact electronics, combining low weight, durability, and effective heat management.