Interfacial enhancement in heterogeneous material bonding: a review of strategies and mechanisms

View at publisher
Authors: Jiaxu Cai, Yongfang Zhang, Chang Yan, Changqing Fang
Cited by: 3
References: 207

Abstract

The pursuit of lightweight design in aerospace and beyond has accelerated the adoption of multi-material structures, where adhesive bonding plays a central role. However, can the interfacial weakness – the primary failure point in such heterogeneous bonds – be systematically overcome? This review moves beyond a mere cataloging of techniques to propose a paradigm shift in interfacial engineering. We synthesize global research into a coherent triadic synergy framework, demonstrating how the concerted application of morphological modulation, chemical modification, and multiscale collaborative enhancement can transcend the limitations of single-mechanism approaches. By critically evaluating surface engineering methods and adhesive reinforcement technologies, we provide a roadmap for designing robust, durable interfaces. This work not only summarizes the state of the art but also outlines a clear path forward, addressing the pressing needs for standardization and predictive durability modeling in critical applications.

Fields of Study & Subjects

Epoxy Resin Curing Processes Mechanical Behavior of Composites 3D IC and TSV technologies

Publication details

Journal / source
Materials and Manufacturing Processes
Publisher
Informa UK Limited
Volume
41
Issue
5
Pages
629–652
Publication date
17 February 2026
Language
EN