Interfacial enhancement in heterogeneous material bonding: a review of strategies and mechanisms
Abstract
The pursuit of lightweight design in aerospace and beyond has accelerated the adoption of multi-material structures, where adhesive bonding plays a central role. However, can the interfacial weakness – the primary failure point in such heterogeneous bonds – be systematically overcome? This review moves beyond a mere cataloging of techniques to propose a paradigm shift in interfacial engineering. We synthesize global research into a coherent triadic synergy framework, demonstrating how the concerted application of morphological modulation, chemical modification, and multiscale collaborative enhancement can transcend the limitations of single-mechanism approaches. By critically evaluating surface engineering methods and adhesive reinforcement technologies, we provide a roadmap for designing robust, durable interfaces. This work not only summarizes the state of the art but also outlines a clear path forward, addressing the pressing needs for standardization and predictive durability modeling in critical applications.
Fields of Study & Subjects
Epoxy Resin Curing Processes
Mechanical Behavior of Composites
3D IC and TSV technologies
Publication details
- Journal / source
- Materials and Manufacturing Processes
- Publisher
- Informa UK Limited
- Volume
- 41
- Issue
- 5
- Pages
- 629–652
- Publication date
- 17 February 2026
- Language
- EN