Recent Advances in EMI-Shielding Aerogels: Mechanisms, Materials, and Scalable Fabrication Methods

Electromagnetic interference (EMI) has become a growing concern with the rapid expansion of compact, high-frequency electronic devices, especially in wearable and portable technologies. This trend has driven the need for lightweight, multifunctional, and efficient shielding materials. Among the various candidates, conductive aerogels have attracted significant attention because of their low density, porous structure, and tunable architectures, which help overcome the limitations of conventional metal- and polymer-based shields. Recent advances in aerogel design have enabled the incorporation of diverse conductive components, including carbon nanostructures, MXenes, metals, and hybrid systems, leading to improved EMI shielding performance. This review systematically examines the relationship between the structural design and compositional engineering of conductive aerogels and their shielding effectiveness. It also highlights recent efforts to enhance specific shielding efficiency, mechanical robustness, and multifunctionality through comparative analysis of current studies. In addition, this review discusses the potential of conductive aerogels for flexible electronics and environmentally friendly applications, with emphasis on scalability, sustainable fabrication, long-term durability, and structure-property optimization. Overall, this review provides a timely perspective on conductive aerogels as next-generation EMI shielding materials.