Dual heterogeneity design in high-strength Cu–Ti alloys via powder metallurgy for enhanced ductility and conductivity

The development of high-strength Cu alloys is constrained by an inherent trade-off between mechanical strength and functional properties such as ductility and electrical conductivity. To overcome this limitation, we report a Cu–Ti alloy with a deliberately engineered dual-heterogeneous architecture fabricated via powder metallurgy. This architecture integrates macroscale grain size heterogeneity with microscale heterogeneity in precipitate distribution, enabling simultaneous enhancements in both ductility and electrical conductivity without compromising strength. As a result, the optimized Cu–3.5Ti alloy exhibits a tensile strength of 1153 MPa, an electrical conductivity of 22% IACS, and an elongation of 4.2%, representing an over 60% enhancement in conductivity compared to conventional cast alloys at equivalent strength levels. Our work provides a novel microstructural design paradigm that utilizes controlled heterogeneity to unlock synergistic properties in high-performance copper alloys.