A non-fitting parameter theoretical model for the pressure-temperature-dependent bandgap energy of semiconductor materials

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Authors: Ruilin Chen, Feiyang Chi, Tianci Yue, Ru Li, Xiaolei Hu, Jianzuo Ma, Weiguo Li, Wenli Pi
Cited by: 0
References: 36

Abstract

Abstract As the core components of equipment designed for detecting extreme environments, semiconductor materials typically encounter the dual challenges of extreme pressure and temperature during the service life. Bandgap energy, a crucial physical parameter of semiconductor materials, is particularly sensitive to pressure and temperature variations. Therefore, it is of significant importance to quantitatively characterize the influences of pressure and temperature on the bandgap energy. In this paper, a non-fitting theoretical model for the pressure-temperature-dependent bandgap energy of semiconductor materials is developed based on the force-heat equivalence energy density principle (Li’s principle of energy equivalence). This model characterizes the quantitative relationship among pressure, temperature, and bandgap energy through considering the equivalent contributions of external pressure work, thermal energy, and bandgap energy to electronic transitions. Furthermore, this model requires only three experimentally available bandgap values to predict bandgap energies at different pressure and temperature. The model’s predictions have achieved good agreement with 16 sets of all the available experimental data. This work provides a theoretical foundation for the performance evaluation and material design of semiconductors under varying pressure and temperature conditions, which is beneficial for expanding the application of semiconductor materials in extreme environments.

Fields of Study & Subjects

High-pressure geophysics and materials Semiconductor materials and interfaces Advanced Materials and Semiconductor Technologies

Publication details

Journal / source
Journal of Physics D Applied Physics
Volume
59
Issue
11
Pages
115106–115106
Publication date
11 March 2026
Language
EN