Study on the influence of laser ball bonding process parameters on temperature field and welding performance of BGA solder balls

Abstract In the field of electronic manufacturing, there are various welding processes, among which laser ball bonding technology is one of the advanced ones. This paper focuses on SAC305 solder balls with a diameter of 0.6 mm and conducts an in-depth study on the behavioral characteristics of the solder balls during the laser ball placement process. The research first uses the MECHANICAL software to carry out temperature field simulation of the solder balls. By adopting the single-factor variable control method and setting two parameters, namely laser power and heating time, it systematically analyzes the influence rules of each parameter on the temperature field distribution of the solder balls. The research results show that: (1) When the laser power increases, the heating rate of the solder balls increases accordingly. Moreover, the higher the laser power, the higher the initial temperature of the solder balls when they are ejected from the nozzle, the faster their phase change occurs, and the faster the molten solder balls are ejected from the nozzle; (2) The increase in laser heating time leads to a corresponding extension of the holding time of the solder balls.It has been verified by experiments that both the simulation model with changing laser power and the simulation model with changing heating time have certain guiding significance.