A methodology for evaluating MEMS switch reliability at cryogenic temperatures

Abstract Current commercially available Micro Electromechanical Systems (MEMS) switches are designed to operate within a limited range of temperatures near room temperature, thus their long-term performance at lower temperatures requires more investigation. We developed a set of reliability test methods for MEMS at cryogenic temperatures. We demonstrate measurements of the commercial MEMS switches’ hysteresis curve widths, contact resistances, and switching times, at up to ten equilibrium temperatures from room temperature down to 18K. We also performed these characterizations as a function of the number of switching cycles, for up to 1 million cycles at temperatures of 18K and 50K. These test methods may potentially help provide MEMS manufacturers and users with data for device development, and for developing guidelines for MEMS cryogenic applications.