Synergistically promoted direct bonding of nanotwinned copper at 200 °C viareductive solvents

Soldering and Surface Mount Technology 2026

View at publisher
Authors: Zehao Zhao, Wei Wu, Li-Yin Gao, Zhi-Quan Liu
DOI: 10.1108/ssmt-11-2025-0066
Cited by: 1
References: 14

Abstract

Purpose This study aims to address the high-temperature bottleneck of Cu-Cu direct bonding in three dimensional (3D) heterogeneous integration (3D HI) by proposing a synergistic regulation strategy involving (111) preferred orientation nanotwinned copper [(111) nt-Cu] and 5% ascorbic acid aqueous solution. Design/methodology/approach Bonding experiments were conducted under 200 °C, 30 MPa and a vacuum of

Fields of Study & Subjects

3D IC and TSV technologies Electronic Packaging and Soldering Technologies Aluminum Alloys Composites Properties

Publication details

Journal / source
Soldering and Surface Mount Technology
Publisher
Emerald
Pages
1–7
Publication date
19 January 2026
Language
EN