Hybrid EBG Structure for Common-Mode Noise and SSN Suppression in Multilayer PCBs

The advancement of modern technologies and the growing demand for high-speed communication systems that integrate digital and analog circuits into multilayer printed circuit boards (PCBs) require the development of efficient solutions to ensure signal integrity (SI), power integrity (PI), and electromagnetic interference mitigation. In this context, this article proposes the design and implementation of a new Electromagnetic Band Gap (EBG) structure, referred to as MS-EBG, with multiple applications, including Common-Mode (CM) noise suppression, Simultaneous Switching Noise (SSN) mitigation, and power integrity preservation. The proposed MS-EBG structure was developed with compact dimensions of 20×20mmand exhibited attenuation levels of up to 40 dB over the frequency range from 1.82 to 18 GHz. The design methodology included equivalent circuit modeling, the incorporation of Defected Ground Structures (DGS), electromagnetic simulations, and experimental validation. The results demonstrate that the MS-EBG structure achieves superior SSN rejection compared to previous studies, while also significantly reducing near-field radiation above 2 GHz. Power integrity measurements revealed an increase in impedance relative to the reference board, although the values remained within acceptable limits for practical applications. Therefore, the MS-EBG structure is shown to be an effective solution for mitigating CM noise and SSN over a wide frequency range, offering reduced physical dimensions compared to alternatives reported in the literature, while simultaneously maintaining both signal and power integrity. Consequently, the proposed structure presents itself as a viable and efficient solution for various applications across broad operational frequency ranges.