Vertical Power Delivery Module Design and Integration for 850A AI ASIC

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Authors: Shenli Zou, Joan Wu, Satyam Saini, Yin Hang, Louie Lu, Jonathan Tang
Cited by: 1
References: 3

Abstract

In this paper, a customized vertical power delivery (VPD) module capable of delivering 850A at 0.85V for AI ASIC is designed, manufactured, and validated with carrier board. The solution follows a two-stage approach, with a fixed-ratio high-density high-efficiency first stage (UBC) and a second stage module integrated with VR controller achieving very high power density (0.8A/mm2, 1200W/inch3). Optimal design workflow targeting at transient response and power conversion efficiency is conducted. Its effectiveness is demonstrated by comprehensive manufacturing design of experiments (DOE) and full engineering validation, making it ready for pre-production adoption.

Fields of Study & Subjects

Low-power high-performance VLSI design Embedded Systems Design Techniques Radiation Effects in Electronics

Publication details

Journal / source
2026 IEEE Applied Power Electronics Conference and Exposition (APEC)
Publisher
IEEE
Pages
2742–2744
Publication date
22 March 2026