Vertical Power Delivery Module Design and Integration for 850A AI ASIC
Abstract
In this paper, a customized vertical power delivery (VPD) module capable of delivering 850A at 0.85V for AI ASIC is designed, manufactured, and validated with carrier board. The solution follows a two-stage approach, with a fixed-ratio high-density high-efficiency first stage (UBC) and a second stage module integrated with VR controller achieving very high power density (0.8A/mm2, 1200W/inch3). Optimal design workflow targeting at transient response and power conversion efficiency is conducted. Its effectiveness is demonstrated by comprehensive manufacturing design of experiments (DOE) and full engineering validation, making it ready for pre-production adoption.
Fields of Study & Subjects
Low-power high-performance VLSI design
Embedded Systems Design Techniques
Radiation Effects in Electronics
Publication details
- Journal / source
- 2026 IEEE Applied Power Electronics Conference and Exposition (APEC)
- Publisher
- IEEE
- Pages
- 2742–2744
- Publication date
- 22 March 2026