A 1 kW, 6.78 MHz GaN Series-Series WPT Using 3D Packaging for Low Parasitic and Thermal Integration Achieving 2 kW/in 3
Fields of Study & Subjects
GaN-based semiconductor devices and materials
3D IC and TSV technologies
Silicon Carbide Semiconductor Technologies
Publication details
- Journal / source
- 2026 IEEE Applied Power Electronics Conference and Exposition (APEC)
- Publisher
- IEEE
- Pages
- 1373–1378
- Publication date
- 22 March 2026