Comparison of Microstrip, Coplanar, and SIW Interconnects on the Same 50-µm-thick GaAs Chip
Fields of Study & Subjects
Radio Frequency Integrated Circuit Design
Microwave Engineering and Waveguides
3D IC and TSV technologies
Publication details
- Journal / source
- 2026 106th ARFTG Microwave Measurement Conference (ARFTG)
- Publisher
- IEEE
- Pages
- 1–4
- Publication date
- 18 January 2026