Efficient Simulation of IC Packages with TEC Based on Adaptive Segmented Method and Spatially-Aware Thermal Neural Network

Asia and South Pacific Design Automation Conference (ASP-DAC) 2026

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Authors: Longfei Li, Xinyue Li, Shunxiang Lan, Liang Chen, Haibao Chen, Min Tang
DOI: 10.1109/asp-dac66049.2026.11420679
Cited by: 0
References: 19

Fields of Study & Subjects

Heat Transfer and Numerical Methods 3D IC and TSV technologies Electronic Packaging and Soldering Technologies

Publication details

Journal / source
Asia and South Pacific Design Automation Conference (ASP-DAC)
Pages
1393–1399
Publication date
19 January 2026
Language
EN