Metal-Enhanced Waffle Wafer Design for Thermomechanical Warpage Reduction in Fan-Out Wafer-Level Packaging
Fields of Study & Subjects
Electronic Packaging and Soldering Technologies
3D IC and TSV technologies
Copper Interconnects and Reliability
Publication details
- Journal / source
- 2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
- Publisher
- IEEE
- Pages
- 31–36
- Publication date
- 26 May 2026