100-nm-level Post-Bond Accuracy and High-Yield Die-to-Wafer Hybrid Bonding System Using Non-Contact Die Transfer

2026 IEEE 76th Electronic Components and Technology Conference (ECTC) 2026

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Authors: Kentaro Mihara, T. M. Hare, Hirofumi Sakai, Shimpei Aoki, Fumihiro Inoue, Akira Uedono, Murugesan Mariappan, Hiroyuki Hashimoto, Takafumi Fukushima
DOI: 10.1109/ectc51846.2026.00029
Cited by: 1
References: 6

Fields of Study & Subjects

3D IC and TSV technologies Electronic Packaging and Soldering Technologies Copper Interconnects and Reliability

Publication details

Journal / source
2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
Publisher
IEEE
Pages
128–135
Publication date
26 May 2026