Glass Core Substrates – Next Generation Advanced Packaging Platform for AI and HPC

2026 IEEE 76th Electronic Components and Technology Conference (ECTC) 2026

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Authors: Srinivas Pietambaram, Tarek Ibrahim, Nicholas Psaila, Hiroki Tanaka, Vinith Bejugam, Dhruba Pattadar, Praveen Sreeramagiri, Manohar Konchady, Jeff Kaplan, Izabela Murtagh, Changhua Liu, Rahul Manepalli
DOI: 10.1109/ectc51846.2026.00134
Cited by: 3
References: 15

Fields of Study & Subjects

3D IC and TSV technologies Electronic Packaging and Soldering Technologies Copper Interconnects and Reliability

Publication details

Journal / source
2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
Publisher
IEEE
Pages
798–803
Publication date
26 May 2026