Wafer-to-Wafer Hybrid Bonding Technology with 200nm Interconnect Pitch

2026 IEEE 76th Electronic Components and Technology Conference (ECTC) 2026

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Authors: Stefaan Van Huylenbroeck, Lieve Bogaerts, Koen D’havé, Soon Aik Chew, Hung-Chieh Tsai, Serena Iacovo, Sven Dewilde, Shuo Kang, Joeri De Vos, Zsolt Tőkei, Eric Beyne
DOI: 10.1109/ectc51846.2026.00185
Cited by: 10
References: 4

Fields of Study & Subjects

3D IC and TSV technologies Electronic Packaging and Soldering Technologies Integrated Circuits and Semiconductor Failure Analysis

Publication details

Journal / source
2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
Publisher
IEEE
Pages
1119–1124
Publication date
26 May 2026