Synchrotron-Based Characterization of Cu/SiCN Pretreatment for Hybrid Bonding via Ozone/Ethylene Radical Activation

2026 IEEE 76th Electronic Components and Technology Conference (ECTC) 2026

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Authors: Bungo Tanaka, Mariappan Murugesan, Soichiro Motoda, Tetsuya Nishiguchi, Yuma Okadome, Tetsu Tanaka, Takafumi Fukushima
DOI: 10.1109/ectc51846.2026.00188
Cited by: 1
References: 14

Fields of Study & Subjects

Advanced ceramic materials synthesis Copper Interconnects and Reliability 3D IC and TSV technologies

Publication details

Journal / source
2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
Publisher
IEEE
Pages
1139–1143
Publication date
26 May 2026