Die-To-Wafer Hybrid Bonding Technology down to 1 μm pitch for Multi-Die Stacking Integration

2026 IEEE 76th Electronic Components and Technology Conference (ECTC) 2026

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Authors: Melissa Najem, Agathe Lerat, Carine Ladner, Loïc Sanchez, Julien Diaz, Renan Bouis, J. Dechamp, Antonio Roman, Myriam Assous, D. Saint-Patrice, L. Masarotto, Stéphane Nicolas
DOI: 10.1109/ectc51846.2026.00218
Cited by: 1
References: 14

Fields of Study & Subjects

3D IC and TSV technologies Electronic Packaging and Soldering Technologies Copper Interconnects and Reliability

Publication details

Journal / source
2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
Publisher
IEEE
Pages
1323–1330
Publication date
26 May 2026