Optical RDL Interposer Technology using Polymeric Hybrid Bonding and Waveguide for Integrated CPO

2026 IEEE 76th Electronic Components and Technology Conference (ECTC) 2026

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Authors: Toshihiko Katayama, Kazuki Inoue, Kyohei Hayashi, Motoya Kaneta, Yuma Tanaka, Ryota Kinoshita, Takafumi Fukushima
DOI: 10.1109/ectc51846.2026.00232
Cited by: 1
References: 8

Fields of Study & Subjects

Nanofabrication and Lithography Techniques 3D IC and TSV technologies Semiconductor Lasers and Optical Devices

Publication details

Journal / source
2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
Publisher
IEEE
Pages
1413–1419
Publication date
26 May 2026