Simultaneous Surface Reduction and Self-Passivation via Ar-CH 4 Plasma for Cu Hybrid Bonding
Fields of Study & Subjects
3D IC and TSV technologies
Copper Interconnects and Reliability
Electronic Packaging and Soldering Technologies
Publication details
- Journal / source
- 2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
- Publisher
- IEEE
- Pages
- 2003–2006
- Publication date
- 26 May 2026